Advanced thermal management materials (Record no. 42209)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 04175nam a22005898a 4500 |
| 001 - CONTROL NUMBER | |
| control field | BDZ0025023660 |
| 003 - CONTROL NUMBER IDENTIFIER | |
| control field | StDuBDS |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20220617123101.0 |
| 006 - FIXED-LENGTH DATA ELEMENTS--ADDITIONAL MATERIAL CHARACTERISTICS | |
| fixed length control field | m||||||||d|||||||| |
| 007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION | |
| fixed length control field | cr ||||||||||| |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 120229s2012 nyua fo 000|0|eng|d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9781461419631: |
| Terms of availability | No price |
| 024 7# - OTHER STANDARD IDENTIFIER | |
| Standard number or code | 10.1007/978-1-4614-1963-1 |
| Source of number or code | doi |
| 040 ## - CATALOGING SOURCE | |
| Original cataloging agency | StDuBDS |
| Language of cataloging | eng |
| Transcribing agency | StDuBDS |
| Modifying agency | StDuBDSZ |
| Description conventions | pn |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TEC |
| Source | ukslc |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TJF |
| Source | thema |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TH |
| Source | thema |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TGMB |
| Source | thema |
| 082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 658.26 |
| 100 1# - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Jiang, Guosheng. |
| 9 (RLIN) | 108164 |
| 245 10 - TITLE STATEMENT | |
| Title | Advanced thermal management materials |
| Medium | [electronic resource] / |
| Statement of responsibility, etc. | by Guosheng Jiang, Liyong Diao, Ken Kuang. |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. | |
| Place of publication, distribution, etc. | New York ; |
| -- | London : |
| Name of publisher, distributor, etc. | Springer, |
| Date of publication, distribution, etc. | 2012. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | 1 online resource : |
| Other physical details | ill. |
| 336 ## - CONTENT TYPE | |
| Content type code | txt |
| 337 ## - MEDIA TYPE | |
| Media type code | c |
| 338 ## - CARRIER TYPE | |
| Carrier type code | cr |
| 347 ## - DIGITAL FILE CHARACTERISTICS | |
| File type | text file |
| Encoding format | |
| Source | rda |
| 500 ## - GENERAL NOTE | |
| General note | springer ebooks |
| 500 ## - GENERAL NOTE | |
| General note | IT Carlow ebook |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Formatted contents note | Introduction to Thermal Management in Microelectronics Packaging -- Requirements of Thermal Management Materials -- Overview of Traditional Thermal Management Materials.-Development of Advanced Thermal Management Materials -- Properties of WCu, MoCu, Cu/MoCu/Cu High Performance Heat Sink Materials and Manufacturing Technologies -- Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications -- ℗¡Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications -- Al/SiC Thermal Management Materials -- Understanding of Laser, Laser diodes, Laser diode packaging and its relationship to Tungsten Copper -- Future Trend of Advanced Thermal Management Materials. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc. | Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions. This book also: Provides an in-depth overview of copper, metal and aluminum materials and discusses the advantages and disadvantages of each in thermal management Discusses numerical simulation methods and techniques used in analysis of electronic devices and materials Covers system and component integration of advanced packaging materials Advanced Thermal Management Materials is an ideal book for microelectronics and packaging engineers, scientists and researchers in academia and industry interested in thermal packaging in high performance systems. ℗¡ |
| 588 ## - SOURCE OF DESCRIPTION NOTE | |
| Source of description note | Description based on CIP data; resource not viewed. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Materials. |
| 9 (RLIN) | 108165 |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Electronics. |
| 9 (RLIN) | 108166 |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Engineering. |
| 9 (RLIN) | 108167 |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Electronic packaging |
| General subdivision | Materials |
| -- | Thermal properties |
| 9 (RLIN) | 108168 |
| 650 #7 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Technology. |
| Source of heading or term | ukslc |
| 9 (RLIN) | 107326 |
| 650 #7 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Electronics engineering |
| Source of heading or term | thema |
| 9 (RLIN) | 108169 |
| 650 #7 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Energy technology & engineering |
| Source of heading or term | thema |
| 9 (RLIN) | 107451 |
| 650 #7 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Engineering thermodynamics |
| Source of heading or term | thema |
| 9 (RLIN) | 108170 |
| 700 1# - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Kuang, Ken. |
| 9 (RLIN) | 108171 |
| 700 1# - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Diao, Liyong. |
| 9 (RLIN) | 108172 |
| 710 2# - ADDED ENTRY--CORPORATE NAME | |
| Corporate name or jurisdiction name as entry element | SpringerLink (Online service) |
| 9 (RLIN) | 107205 |
| 773 0# - HOST ITEM ENTRY | |
| Title | Springer eBooks |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY | |
| Relationship information | Printed edition: |
| International Standard Book Number | 9781461419624 |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Link text | Read this electronic book via the web |
| Uniform Resource Identifier | <a href="https://ezproxy.itcarlow.ie/login?url=http://dx.doi.org/10.1007/978-1-4614-1963-1">https://ezproxy.itcarlow.ie/login?url=http://dx.doi.org/10.1007/978-1-4614-1963-1</a> |
| 902 ## - LOCAL DATA ELEMENT B, LDB (RLIN) | |
| a | 160105 |
| 907 ## - LOCAL DATA ELEMENT G, LDG (RLIN) | |
| a | .b10442923 |
| b | none |
| c | - |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Suppress in OPAC | 0 |
| Source of classification or shelving scheme | Dewey Decimal Classification |
| 998 ## - LOCAL CONTROL INFORMATION (RLIN) | |
| Operator's initials, OID (RLIN) | 0 |
| Cataloger's initials, CIN (RLIN) | 140305 |
| First Date, FD (RLIN) | m |
| Local | h |
| -- | - |
| -- | 0 |
No items available.