000 | 01773cam a2200373Ka 4500 | ||
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999 |
_c39272 _d39272 |
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003 | OSt | ||
005 | 20171201122230.0 | ||
006 | m d | ||
007 | cr cn| | ||
008 | 120504s2012 xxu o 001 0 eng d | ||
020 | _a9781118166727 (electronic bk.) | ||
020 | _a1118166728 (electronic bk.) | ||
035 | _a(OCoLC)793103961 | ||
037 |
_a10.1002/9781118166727 _bWiley InterScience _nhttp://www3.interscience.wiley.com |
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040 |
_aDG1 _beng _cDG1 _dIEEEE |
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049 | _aTIZA | ||
082 | _a621.3815 | ||
100 | 1 | _aLi, Er-Ping. | |
245 | 1 | 0 |
_aElectrical modeling and design for 3D system integration _h[electronic resource] : _b3D integrated circuits and packaging, signal integrity, power integrity and EMC / _cEr-Ping Li. |
260 |
_a[United States] : _bIEEE Press ; _aHoboken : _bWiley, _cc2012. |
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300 | _a1 online resource. | ||
500 | _aIncludes index. | ||
500 | _aIT Carlow ebook | ||
500 | _aIEEE ebook | ||
505 | 0 | _aMacromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration. | |
650 | 0 | _aThree-dimensional integrated circuits. | |
655 | 7 |
_aElectronic books. _2local |
|
710 | 2 |
_aWiley InterScience (Online service) _928344 |
|
856 | 4 | 0 |
_yRead this electronic book via the web (On Campus access) _uhttp://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551 |
856 | 4 | 0 |
_yRead this electronic book via the web (Off Campus access) _uhttp://ieeexplore.ieee.org/servlet/wayf.jsp?entityId=https://idp.itcarlow.ie/idp/shibboleth&url=http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551 |
856 | 4 | 1 |
_ySend a message to library staff if access to this online resource is unavailable _umailto:libdesk@itcarlow.ie?subject=Resource%20unavailable |
902 | _a160105 | ||
907 |
_a.b10412396 _bnone _c- |
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942 |
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998 |
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