000 01773cam a2200373Ka 4500
999 _c39272
_d39272
003 OSt
005 20171201122230.0
006 m d
007 cr cn|
008 120504s2012 xxu o 001 0 eng d
020 _a9781118166727 (electronic bk.)
020 _a1118166728 (electronic bk.)
035 _a(OCoLC)793103961
037 _a10.1002/9781118166727
_bWiley InterScience
_nhttp://www3.interscience.wiley.com
040 _aDG1
_beng
_cDG1
_dIEEEE
049 _aTIZA
082 _a621.3815
100 1 _aLi, Er-Ping.
245 1 0 _aElectrical modeling and design for 3D system integration
_h[electronic resource] :
_b3D integrated circuits and packaging, signal integrity, power integrity and EMC /
_cEr-Ping Li.
260 _a[United States] :
_bIEEE Press ;
_aHoboken :
_bWiley,
_cc2012.
300 _a1 online resource.
500 _aIncludes index.
500 _aIT Carlow ebook
500 _aIEEE ebook
505 0 _aMacromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration.
650 0 _aThree-dimensional integrated circuits.
655 7 _aElectronic books.
_2local
710 2 _aWiley InterScience (Online service)
_928344
856 4 0 _yRead this electronic book via the web (On Campus access)
_uhttp://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551
856 4 0 _yRead this electronic book via the web (Off Campus access)
_uhttp://ieeexplore.ieee.org/servlet/wayf.jsp?entityId=https://idp.itcarlow.ie/idp/shibboleth&url=http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551
856 4 1 _ySend a message to library staff if access to this online resource is unavailable
_umailto:libdesk@itcarlow.ie?subject=Resource%20unavailable
902 _a160105
907 _a.b10412396
_bnone
_c-
942 _n0
_2ddc
998 _b0
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_eh
_f-
_g0