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008			120229s2012 nyua fo 000|0|eng|d
020			_a9781461419631: _cNo price
024	7		_a10.1007/978-1-4614-1963-1 _2doi
040			_aStDuBDS _beng _cStDuBDS _dStDuBDSZ _epn
072		7	_aTEC _2ukslc
072		7	_aTJF _2thema
072		7	_aTH _2thema
072		7	_aTGMB _2thema
082			_a658.26
100	1		_aJiang, Guosheng. _9108164
245	1	0	_aAdvanced thermal management materials _h[electronic resource] / _cby Guosheng Jiang, Liyong Diao, Ken Kuang.
260			_aNew York ; _aLondon : _bSpringer, _c2012.
300			_a1 online resource : _bill.
336			_btxt
337			_bc
338			_bcr
347			_atext file _bPDF _2rda
500			_aspringer ebooks
500			_aIT Carlow ebook
505	0		_aIntroduction to Thermal Management in Microelectronics Packaging -- Requirements of Thermal Management Materials -- Overview of Traditional Thermal Management Materials.-Development of Advanced Thermal Management Materials -- Properties of WCu, MoCu, Cu/MoCu/Cu High Performance Heat Sink Materials and Manufacturing Technologies -- Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications -- ℗¡Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications -- Al/SiC Thermal Management Materials -- Understanding of Laser, Laser diodes, Laser diode packaging and its relationship to Tungsten Copper -- Future Trend of Advanced Thermal Management Materials.
520			_aAdvanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions. This book also: Provides an in-depth overview of copper, metal and aluminum materials and discusses the advantages and disadvantages of each in thermal management Discusses numerical simulation methods and techniques used in analysis of electronic devices and materials Covers system and component integration of advanced packaging materials Advanced Thermal Management Materials is an ideal book for microelectronics and packaging engineers, scientists and researchers in academia and industry interested in thermal packaging in high performance systems. ℗¡
588			_aDescription based on CIP data; resource not viewed.
650		0	_aMaterials. _9108165
650		0	_aElectronics. _9108166
650		0	_aEngineering. _9108167
650		0	_aElectronic packaging _xMaterials _xThermal properties _9108168
650		7	_aTechnology. _2ukslc _9107326
650		7	_aElectronics engineering _2thema _9108169
650		7	_aEnergy technology & engineering _2thema _9107451
650		7	_aEngineering thermodynamics _2thema _9108170
700	1		_aKuang, Ken. _9108171
700	1		_aDiao, Liyong. _9108172
710	2		_aSpringerLink (Online service) _9107205
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9781461419624
856	4	0	_yRead this electronic book via the web _uhttps://ezproxy.itcarlow.ie/login?url=http://dx.doi.org/10.1007/978-1-4614-1963-1
902			_a160105
907			_a.b10442923 _bnone _c-
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998			_b0 _c140305 _dm _eh _f- _g0
999			_c42209 _d42209