Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC /
Li, Er-Ping.
Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC / [electronic resource] : Er-Ping Li. - [United States] : Hoboken : IEEE Press ; Wiley, c2012. - 1 online resource.
Includes index. IT Carlow ebook IEEE ebook
Macromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration.
9781118166727 (electronic bk.) 1118166728 (electronic bk.)
10.1002/9781118166727 Wiley InterScience http://www3.interscience.wiley.com
Three-dimensional integrated circuits.
Electronic books.
621.3815
Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC / [electronic resource] : Er-Ping Li. - [United States] : Hoboken : IEEE Press ; Wiley, c2012. - 1 online resource.
Includes index. IT Carlow ebook IEEE ebook
Macromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration.
9781118166727 (electronic bk.) 1118166728 (electronic bk.)
10.1002/9781118166727 Wiley InterScience http://www3.interscience.wiley.com
Three-dimensional integrated circuits.
Electronic books.
621.3815