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Electrical modeling and design for 3D system integration [electronic resource] : 3D integrated circuits and packaging, signal integrity, power integrity and EMC / Er-Ping Li.

By: Contributor(s): Material type: TextTextPublication details: [United States] : IEEE Press ; Hoboken : Wiley, c2012.Description: 1 online resourceISBN:
  • 9781118166727 (electronic bk.)
  • 1118166728 (electronic bk.)
Subject(s): Genre/Form: DDC classification:
  • 621.3815
Online resources:
Contents:
Macromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration.
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Includes index.

IT Carlow ebook

IEEE ebook

Macromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration.

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