Electrical modeling and design for 3D system integration [electronic resource] : 3D integrated circuits and packaging, signal integrity, power integrity and EMC / Er-Ping Li.
Material type:![Text](/opac-tmpl/lib/famfamfam/BK.png)
- 9781118166727 (electronic bk.)
- 1118166728 (electronic bk.)
- 621.3815
Includes index.
IT Carlow ebook
IEEE ebook
Macromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration.