Electrical modeling and design for 3D system integration [electronic resource] : 3D integrated circuits and packaging, signal integrity, power integrity and EMC / Er-Ping Li.
Material type: TextPublication details: [United States] : IEEE Press ; Hoboken : Wiley, c2012.Description: 1 online resourceISBN:- 9781118166727 (electronic bk.)
- 1118166728 (electronic bk.)
- 621.3815
Includes index.
IT Carlow ebook
IEEE ebook
Macromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration.